Our cutting-edge technology enables contactless chip failure analysis at the microscopic level, revealing failure mechanisms invisible to traditional techniques.
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By capturing magnetic field patterns generated by current flow deep inside integrated circuits, we offer insights into a broad range of failure modes, from subtle interconnect issues to power distribution anomalies and beyond.
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By harnessing quantum sensing, we’re enabling chip developers to accelerate root-cause analysis, reduce costly iterations, and increase yield and reliability of their products.

 Production Test & Monitoring

✓ Contactless testing
✓ Inspect buried structures non-destructively
✓ Fast fingerprinting: detect process variations early

 The essential tool for in-line testing