CSO, Co-founder
Assoc. Professor, quantum sensing,
DTU Physics
Our cutting-edge technology enables contactless chip failure analysis at the microscopic level—revealing failure mechanisms invisible to traditional techniques.
By capturing magnetic field patterns generated by current flow deep inside integrated circuits, we offer insights into a broad range of failure modes, from subtle interconnect issues to power distribution anomalies and beyond.
By harnessing quantum sensing, we’re enable chip developers to accelerate root-cause analysis, reduce costly iterations, and increase yield and reliability of their products.
